The pressure sensor is an assembly of a micromachined silicon part and pyrex™ glas.
Four polysilicon Piezo Resistances have been implemented, on top of silicon, just
above the sensor's membrane. The membrane is only a few micrometers thick and deflects
depending on the pressure difference existing between its two sides.
For differential sensors, the pyrex™ is drilled with a hole below the membrane
(see picture left) so that pressure can be applied on both sides.
For absolute sensors, the pyrex™ has no hole and vacuum is created in the
cavity underneath the sensor when the pyrex™ is sealed with the silicon. This
step is called "Anodic bonding".
Most Important Manufacturing steps
Electrical Wafer Sort (EWS)
SP4 process
Sensor design optimized for high output signal
1-12 bar sensors absolute and gauge
8 Mask levels
Implanted Piezo Resistors
Low offset drift
Wafer are 100% electrically tested (see picture on the left)
Micromachining process
Anisotropic KOH etching of silicon for membrane forming
Thickness control with eletrochemical etch-stop
Anodic bonding of pyrex™ glas to silicon
Double sided wafer alignment
Reliable hermetic connection
Wafer dicing on blue tape
Two sides optical inspection
KOH etching
Die attach
Thick Film Hybrid Assembly
Screenprinting
Die attach
Pick & Place
Thick Film Hybrid Assembly (continued)
Wire bonding (gold and aluminium)
Reflow soldering for SMD components
Chip coating (globtop)
Low stress humidity protection
Flux free leadframe soldering
Laser trimming of thick film resistors
Laser marking
Wire bonding
Electrical trimming in pressure chamber
Test & Calibration
Automated sensor testing with temperature and pressure from -40°C to +125°C